Cross sectioning process with two table top units
Advantages of the MSC systems
Very high precision, i.e. also suitable for laser drilling
The microsection is standardized and can be executed quickly even by semiskilled personnel
High throughput volume is possible; a single person can process > 100 specimens/layers
Significant reduction of material consumption (sand paper, resin, etc.)
1) Precise milling machine (S-OSR)
2) Z-axis controlled grinding and polishing machine (SPA)
Features of the two steps processes
Digital video camera system which prepares the coupon (S-OSR)
Easy handling with touch screen and computer mouse
High flexibility through parameter set up
Desktop design fits everywhere in your lab and process environment
All FR4 type and other base materials processable, also with heavy Copper Aluminum carrier
Maximum processable PCB thickness around 6 mm
Standard cutter: 2.4 (Shaft 3.175; spiral length 6-8 mm)
Coupon size: standard 21×10, maximum 30×14 mm
Additional holes in the coupon possible
Optional - Additional Three position polishing machine (MPA)
Workflow:
Defining the exact coupon location and cross section target area using the video camera
Milling the coupon from the circuit board
Inserting the coupons into specimen holders (pucks); no need for pinsFilling with casting resin
Fully automatic sanding and polishing to the center of the target holes with the SPA
Multifunctional desktop coupon router (OSR)
Features:
The OSR is a very flexible and handy milling machine for extracting coupons from printed circuit boards
All kind of base materials can be processed up to a thickness of 6 mm