Chemplate Materials SL, located in Barcelona, Spain, manufactures and sells machinery and chemical products for the electroplating and electronics industries. They developed their first production machines for the induction layer joining process in collaboration with CDTI, in 2012. A patent was granted for the technology called InduBond® (currently an industry standard), which marked a major step for the company in terms of internationalization and business expansion and it also signaled the creation of a distribution network in the main markets. Chemplate’s is in a constant growth, focusing on research and development for new products and keeping their technological independence in supplying key technologies, which is essential.
The InduBond RFX is a machine for registration and bonding multilayer printed circuits
Layer centering and registration are done using a custom high-precision ( Layer registration is ensured by induction soldering the layers
The InduBond RFX also incorporates an automated system of moving heads that makes it possible to quickly solder anywhere on the panel surface
This process has been developed specifically for rigid flexible circuits
Reduce handling time of Prepreg and cores avoiding scratches
Assure correct order layup process avoiding human mistakes
The system is fully compatible to work together with PinLam or PinLessLam processes
High storage capacity, up to 20 trays predefine
The system can be equipped with dedicated Lay-Up table, compact and ergonomic
InduBond ® 130N is a registration and induction bonding machine for aligning and soldering a group of inner layers and prepreg that make up a multilayer circuit in the step prior to pressing.
The system provides repeat ability, safety and trustworthiness
The centering, or registration, of the layers is done with a custom high-precision pin template (<10 microns)
registration is ensured by induction soldering the layers using 4 (or optionally 6) soldering heads per induction that uniformly apply pressure and heat the inner layers until the resin and prepreg are melted